| 摘要 |
A package for providing electromagnetic shielding for microwave circuits. The package includes a top board having an upper surface, a lower surface opposite to the upper surface and a side surface joining the upper surface and the lower surface, and a bottom board having an upper surface attached to the lower surface of the top board, a lower surface opposite to the upper surface and an outer side surface joining the upper surface and the lower surface. The top board further includes at least one ground layer formed therein and a first metal coating formed on at least part of the side surface of the top board. The bottom board includes an inner side surface extending from the upper surface of the bottom board toward the lower surface of the bottom board and an inner lower surface joining the inner side surface, thereby providing an inner space for accommodating the microwave circuit. The bottom board further includes a second metal coating formed on at least part of the outer side surface of the bottom board and a third metal coating formed on at least part of the lower surface of the bottom board. The ground layer, the first metal coating, the second metal coating and the third metal coating are electrically coupled to provide an electric shield for the microwave circuit.
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