| 摘要 |
Disclosed is a method for manufacturing an image sensor. The method includes a process for removing foreign matter from a non-device area of a wafer before forming contacts in a device area of the wafer. According to an embodiment, an insulating layer formed in the non-device area is removed by performing a first process with respect to the non-device area. Then, a contact can be formed in the insulating layer in the device area.
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