发明名称 |
Thin multi-chip flex module |
摘要 |
A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.
|
申请公布号 |
US2009168366(A1) |
申请公布日期 |
2009.07.02 |
申请号 |
US20080317754 |
申请日期 |
2008.12.29 |
申请人 |
|
发明人 |
CLAYTON JAMES E.;FATHI ZAKARYAE |
分类号 |
H05K1/18;H05K3/30;H05K7/20 |
主分类号 |
H05K1/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|