| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve miniaturization and thinning of a semiconductor device onto which semiconductor chips are laminated. <P>SOLUTION: In a laminated primary memory chip and secondary memory chip 2, a primary pad of the primary memory chip on the lower stage hidden under the upper secondary memory chip 2 is pulled out through re-wiring, thus making it possible to wire-connect the primary pad pushed out and exposed from the upper-stage secondary memory chip 2 and a secondary pad 2d of the upper-stage secondary memory chip 2. Further, a microcomputer chip 3 and a tertiary pad 2e formed on a re-wire 2f are connected by wire 4 on the uppermost-stage secondary memory chip 2, thereby enabling wire-connection of multiple laminated memory chips to be realized with no intervention of spacers. <P>COPYRIGHT: (C)2009,JPO&INPIT |
