| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is highly reliable when mounting the device on a mother board, is small-sized, also has an excellent heat radiation property, can obtain excellent conductivity between a semiconductor element and a die pad, and is applied even to a product requiring electrical connection on the back surface of the semiconductor element, and its manufacturing method. <P>SOLUTION: The semiconductor device includes the die pad 2 on a resin substrate 1, the semiconductor element 4 fixed to the die pad 2 with an adhesive 3, a plurality of electrode terminals 6 electrically connected with the semiconductor element 4, a resin sealing body 7 for sealing the die pad 2, the semiconductor element 4 and the electrode terminals 6, and an external terminal 8 electrically connected with the electrode terminals 6 through a via respectively. A silicon oxide (SiO<SB>2</SB>) 18b is formed on the surface of the die pad 2, and the semiconductor element 4 is fixed onto the silicon oxide with the adhesive 3. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
