| 摘要 |
PROBLEM TO BE SOLVED: To make a holding jig used when a package substrate is partitioned adaptable also to a small-sized device package in a cutting device. SOLUTION: The holding jig 5 which is partitioned by a partition schedule line is held by a chuck table sucking/holding the package substrate with a plurality of package devices formed, and intervenes between the chuck table and the package substrate to be cut comprises the escape channel 54 of a cutting plate at a position corresponding to the partition schedule line of the package substrate on the surface of a metal plate and a suction hole 53 which penetrates the front and the back of the metal plate and sucks and holds each package device. The surface of the metal plate is coated with a resin layer 55. COPYRIGHT: (C)2009,JPO&INPIT |
