SPUTTERING APPARATUS, SPUTTER FILM FORMING METHOD, AND ANALYZER

摘要

A sputtering apparatus comprises a substrate holder and a target susceptor. The substrate holder includes a first stage on which a substrate is placed and which is rotatable around a first rotary shaft, a second stage rotatable around a second rotary shaft disposed apart from the first rotary shaft, planetary motion means for rotating the first stage around the first rotary shaft and orbital motion means for rotating the second stage around the second rotary shaft thereby orbitally rotating the first stage around the second rotary shaft. The target susceptor includes magnetic field supply means for supplying a magnetic field in a specific direction to the substrate and a target susceptor on which a target for forming a film on the substrate is placed. The planetary motion means rotates the first stage in the opposite direction to the direction of the rotation of the orbital motion means in such a way that the specific direction of the supplied magnetic field is maintained.