| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board capable of forming a via of high reliability and sufficiently preventing etch-back and excessive protrusion of glass cloth from the wall surface of a via hole. <P>SOLUTION: The method of manufacturing the multilayer printed wiring board includes the steps of forming, by laser irradiation, a via hole 5 in an insulating layer 4 formed by a prepreg 3 comprised of a glass cloth 1 impregnated with a thermosetting resin composition 2, subjecting the via hole 5 to a glass etching processing with a glass etching solution, and then subjecting the via hole to a desmear processing with an oxidizing agent solution. This arrangement sufficiently prevents etch-back and excessive protrusion of the glass cloth from the wall surface of the via hole and achieves highly reliable via, particularly, in a small via hole having a top diameter of ≤75 μm. <P>COPYRIGHT: (C)2009,JPO&INPIT |
