| 摘要 |
PROBLEM TO BE SOLVED: To provide a device capable of sticking an adhesive film on a semiconductor wafer, even if the semiconductor wafer is surrounded by a dicing frame. SOLUTION: The device 20 for sticking the adhesive film includes: a stage 22; a ramp 24; a drive section 26; and a laminate roll 28. On the stage 22, a body 10 to be treated is placed. The body 10 to be treated has: a dicing tape 12; a semiconductor wafer 14 where a plurality of bump electrodes 14a are provided on a circuit surface S1 and a back S2 is stuck to the dicing tape 12; and an annular dicing frame 16 stuck to the dicing tape 12 to surround the semiconductor wafer 14. The ramp 24 is connected to the drive section 26 via a drive shaft 26a and raises the semiconductor wafer 14. The laminate roll 28 sticks an adhesive film F onto the circuit surface S1 of the semiconductor wafer 14 while the semiconductor wafer 14 has been raised by the ramp 24. COPYRIGHT: (C)2009,JPO&INPIT
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