发明名称 WIRING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a wiring structure that decreases the number of members. SOLUTION: In a wiring structure 1 where wiring 8 is formed on the surface of a structure 4 obtained by bonding a first main molding 2 and a second molding 3 molded of a material different from that of the first molding 2, the continuous wiring 8 is formed astride the first molding 2 and the second molding 3. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009147010(A) 申请公布日期 2009.07.02
申请号 JP20070321161 申请日期 2007.12.12
申请人 RICOH CO LTD 发明人 OKURA HIDEAKI;SANO TAKESHI;KOBAYASHI HIROSHI
分类号 H05K1/02;H05K1/18;H05K3/00 主分类号 H05K1/02
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