Printed circuit board for testing e.g. electronic device, has set of bypass pads testing electric circuit i.e. memory and formed of copper, and solder resist layer exposing external pads and covering bypass pads

摘要

The board (100) has a set of external pads (115) coupled with an external device (300c). A set of bypass pads (120) tests an electric circuit i.e. memory, where the external pads are exposed and the bypass pads are not exposed from an outer surface of the board. The pads are placed adjacent to a same side of the board. A core insulator comprises a pair of surfaces (107, 108) opposite to each other. The bypass pads are formed on one of the surfaces of the insulator. A solder resist (SR) layer exposes the external pads and covers the bypass pads that are formed of copper. Independent claims are also included for the following: (1) a system comprising a printed circuit board (2) a method for testing an electric circuit (3) a method for forming a printed circuit board.