发明名称 METHOD OF MANUFACTURING A SUPERJUNCTION DEVICE WITH CONVENTIONAL TERMINATIONS
摘要 A method of manufacturing a semiconductor device includes providing a semiconductor substrate having a heavily doped region of a first conductivity and has a lightly doped region of the first conductivity. The semiconductor substrate a plurality of trenches etched into an active region of the substrate forming a plurality of mesas. A preselected area in the active region is oxidized and then etched using a dry process oxide etch to remove the oxide in the bottoms of the trenches. A protective shield is formed over a region at a border between the active region and the termination region. The protective shield is partially removed from over the preselected area. Dopants are implanted at an angle into mesas in the preselected area. The plurality of trenches are with an insulating material, the top surface of the structure is planarized and a superjunction device is formed on the structure.
申请公布号 EP1701686(A4) 申请公布日期 2009.07.01
申请号 EP20040813607 申请日期 2004.12.10
申请人 THIRD DIMENSION (3D) SEMICONDUCTOR, INC. 发明人 HSHIEH, FWU-IUAN
分类号 H01L21/336;H01L21/265;H01L21/266;H01L29/06;H01L29/78;H01L29/812 主分类号 H01L21/336
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