发明名称 |
METHOD FOR PREVENTING TIN WHISKER BY ELETROLESS PLATING |
摘要 |
A method for preventing tin whisker by eletroless plating is provided to prevent the generation of tin whisker conveniently without causing a pin hole on the tin coating in plating method forming the tin coating on the under layer. A method for preventing tin whisker by eletroless plating comprises a step of forming an under layer of electroless tin-silver alloy on a piece to be plated, and a step of forming electroless tin coating on the under layer. The thickness of the underlayer is 0.025~0.5mum, and the total thickness of the under layer and the coating is 0.1~6mum. The content of silver in the coating is 5~90 weight%.
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申请公布号 |
KR20090071388(A) |
申请公布日期 |
2009.07.01 |
申请号 |
KR20080126730 |
申请日期 |
2008.12.12 |
申请人 |
ISHIHARA CHEMICAL CO., LTD. |
发明人 |
TANAKA KAORU;FUKAMI TAKURO;ASAHI HIROSHI |
分类号 |
C23C18/54;C23C18/16 |
主分类号 |
C23C18/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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