发明名称 METHOD FOR PREVENTING TIN WHISKER BY ELETROLESS PLATING
摘要 A method for preventing tin whisker by eletroless plating is provided to prevent the generation of tin whisker conveniently without causing a pin hole on the tin coating in plating method forming the tin coating on the under layer. A method for preventing tin whisker by eletroless plating comprises a step of forming an under layer of electroless tin-silver alloy on a piece to be plated, and a step of forming electroless tin coating on the under layer. The thickness of the underlayer is 0.025~0.5mum, and the total thickness of the under layer and the coating is 0.1~6mum. The content of silver in the coating is 5~90 weight%.
申请公布号 KR20090071388(A) 申请公布日期 2009.07.01
申请号 KR20080126730 申请日期 2008.12.12
申请人 ISHIHARA CHEMICAL CO., LTD. 发明人 TANAKA KAORU;FUKAMI TAKURO;ASAHI HIROSHI
分类号 C23C18/54;C23C18/16 主分类号 C23C18/54
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