| 摘要 |
An ingot clamping unit and an ingot cutting apparatus including the same are provided to improve the flatness of wafer by preventing bending of ingot when cutting the ingot. An ingot clamping unit comprises ingot mounting units(61,62) which are attached to the upper curved surface of ingot(I) in the longitudinal direction to hold ingot, a vertical moving table(63) combined with the ingot mounting unit to move the ingot mounting unit vertically, and an ingot holding unit(70) which is combined in the vertical moving table or the ingot mounting unit and makes contact with the right and left curved surfaces of the ingot. The ingot holding unit has a wire saw groove through which a wire saw(40) passes. |
