发明名称 TOP NOZZLE AND SUBSTRATE TREATMENT APPARATUS
摘要 A top nozzle and a substrate processing apparatus are provided to improve cleaning efficiency by preventing the leakage of the cooling gas of an electrostatic chuck and a particle. A chuck is arranged in a process chamber and supports a substrate. A top nozzle(140) is arranged in the upper part of the process chamber and supplies the process gas and the cleaning gas to the process chamber. The top nozzle includes a first body(142), a second body(144), and a third body(148). The first body has a tube shape with a process gas path. The second body is extended from the first body downwardly and has a plate shape with the larger diameter than the first body. The third body has a cleaning gas path inside and has the tube shape which is positioned in the upper part of the second body. The second body passes through from the upper part to the lower part.
申请公布号 KR20090070573(A) 申请公布日期 2009.07.01
申请号 KR20070138624 申请日期 2007.12.27
申请人 SEMES CO., LTD. 发明人 WON, JUN HO
分类号 H01L21/205 主分类号 H01L21/205
代理机构 代理人
主权项
地址
您可能感兴趣的专利