| 摘要 |
A method for manufacturing an alumina complex capillary for a semiconductor wire bonding and the alumina complex capillary are provided to improve a bonding by obtaining a product having a wire bonding alumina and a complex capillary. A fine alumina powder is made of an alumina powder 90.0 weight% to 97.0 weight%, a zirconia powder 1.0 weight% to 8.0 weight%, 85 weight%, an ethylene resin group 5 weight% to 20 weight%, wax type 3 weight% to 10 weight% is formed(S10), a chrome oxide powder 0.5 weight% to 3 weight%. A molding product of the capillary shape is shaped as the formed slurry(S20), and the capillary molding product from which the binder is removed successively is heated by a temperature of 950°C to 1550°C.
|
