| 摘要 |
<p>A light emitting diode package module is provided to improve the efficiency for heat dissipation by emitting the heat of the high temperature of LED packages through a heat sink to outside. The light emitting diode package module(100) comprises a printed circuit board(110), and a heat sink(120) and one or more LED package(130). The heat sink is combined in the one side of a printed circuit board. A plurality of region of the heat sink is exposed to outside through the printed circuit board. The LED package connects with the printed circuit board. The LED package is mounted on the exposed regions.</p> |
