APPARATUS AND METHOD FOR INSPECTING SOLDER BUMP FORMATION AND TRANSFER STATE USING ELECTRON BEAM IN WAFER BUMPING PROCESS

摘要

An apparatus and a method for inspecting solder bump formation and transfer state using an electron beam are provided to sense a back scattered electronic by using an electron beam discharging unit. An electron beam emission unit(11) like an electron gun emits an electronic beam to an object(19), and a deflection and acceleration unit(12) perform deflection and acceleration of the electronic beam. A detector(13) senses an electron emitted from the object and converts it into an electrician signal. A signal process unit(14) generates arrangement information of metal material formed on the object by processing an electrical signal from the detector.