APPARATUS FOR TREATING SUBSTRATE

摘要

A substrate processing device is provided to improve uniformity of a substrate process by minimizing the deformation of the substrate by solving the pressure difference between the upper part and the lower part. A substrate support member supports a substrate in an upwardly separate state. A process liquid supplying member supplies the process liquid to the substrate. A first gas spraying member(150) sprays the gas to the edge of the lower part of the substrate to prevent the process liquid from being inputted to the lower part of the substrate. The second gas spraying member(160) sprays the gas to the center region of the lower part of the substrate to solve the pressure difference between the upper and lower parts of the substrate generated by the gas sprayed from the first gas spray member. The first gas spraying member is inclined in the supporting plate to spray the gas to the edge of the lower part of the substrate. The substrate support member includes a support plate of a disc shape and pin members installed in the upper part of the support plate.