| 摘要 |
A polishing composition includes colloidal silica. The colloidal silica has such a particle diameter as to satisfy the relationship of the inequality: D<SUB>SA</SUB><=D<SUB>N4</SUB>, between an average primary particle diameter D<SUB>SA </SUB>of the colloidal silica calculated on the basis of a BET method and an average secondary particle diameter D<SUB>N4 </SUB>of the colloidal silica measured by a laser diffraction method. The colloidal silica has the average secondary particle diameter D<SUB>N4 </SUB>of 30 nm or smaller. The polishing composition can inhibit a polishing rate from remarkably decreasing due to clogging in a polishing pad. |
