| 摘要 |
A compact, thin type and high cooling performance cooling device, an electronic apparatus and a method of manufacturing the same are provided. The cooling device ( 1 ) has a pair of a first substrate ( 2 ) and a second substrate ( 3 ) which are made of such a material having a low thermal diffusibility as glass, formed rectangular and bonded together via a silicon member ( 4 ). On bonding surfaces of these substrates ( 2 ) and ( 3 ), grooves ( 5 ) and ( 6 ) are formed. These grooves ( 5 ) and ( 6 ) are formed so as to function as a heat pipe of a loop type when these substrates ( 2 ) and ( 3 ) are bonded. |
