发明名称 LASER BEAM MACHINING METHOD
摘要 <p>A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line 5 along which the object is intended to be cut. Thereafter, the object 1 is irradiated with laser light L2 transmittable through an unmodified region of the object 1, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line 5 along which the object is intended to be cut. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line 5 along which the object is intended to be cut. <IMAGE></p>
申请公布号 EP1609558(A4) 申请公布日期 2009.07.01
申请号 EP20030712673 申请日期 2003.03.12
申请人 HAMAMATSU PHOTONICS K.K. 发明人 FUKUYO, FUMITSUGU;FUKUMITSU, KENSHI;UCHIYAMA, NAOKI;WAKUDA, TOSHIMITSU;ATSUMI, KAZUHIRO;MURAMATSU, KENICHI
分类号 B23K26/38;B23K26/18;B23K26/42;B28D1/22;B28D5/00;H01L21/301 主分类号 B23K26/38
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