Apparatus of treating wafer using chemical solution

摘要

An apparatus of treating wafer using chemical solution is provided to uniformly process the surface of a plurality of wafers by using a plurality of cassette driving part. A plurality of cassettes(110) of the pillar type is separated in regular interval. A plurality of slots is formed in one side direction of the cassette. A plurality of cassettes mounts horizontally a plurality of wafers(130) on the rotational plate. A plurality of cassette driving parts(230) rotates the cassette by being adhered to one side of the cassette. The nozzle(120) is arranged between a plurality of cassettes to spray the chemical solution to a slot direction.