| 摘要 |
A semiconductor depositing device is provided to prevent a wafer failure by including a signal for controlling the pressure of the gas transmitted to a pulverizer in an output signal of a controller. An injector(1) sprays the deposition gas on a wafer inputted to the inside of a process chamber. A manifold(3) is connected to a lower part of an injector and collects the remaining gas temporarily. A pulverizer(2) is comprised between a plurality of injectors and manifold and pulverizes the powder in a by-product generated after a deposition process. An exhaust line is connected to one end of the manifold and exhausts the remaining elements to the outside. A multiplexer extracts the exhaust pressure of the plurality of pulverizers. A transducer(20) converts the extraction value by the multiplexer into a digital value. A controller(10) outputs a signal to control each pulverizer by comparing an output value with the predetermined value. An output unit(40) receives a control signal of the controller and outputs the information recognized by a user.
|
