| 摘要 |
A peeling test method for a back metal layer of a semiconductor device of vertical type is provided to perform the back metal peeling test without the back metal peeling test apparatus. A vertical type semiconductor device except for a back metal layer is implemented as the wafer sample(S100). The substrate back side of the wafer sample is ground by using a polishing device(S105). The mesh pattern is positioned in the substrate back side of the wafer sample. The back metal is formed through the evaporation of metal(S115). The peeling test tape is attached to the back metal by using the tape lamination equipment of the polishing device(S120). The test tape is eliminated by using the tape removing equipment of the polishing device(S125).
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