发明名称 TEST PATTERN FOR ANALYZING CAPACITANCE CHARACTERIZATION OF INTERCONNECTION LINE
摘要 A test pattern for analyzing capacitance characterization of interconnection line is provided to accurately analyze the connection wiring capacitance by extracting a parasitic component of a connection wiring and a pad. The first switching terminal(40a) and the first probe pad(30a) are combined with both ends of the first metal line(20a). The first switching terminal is combined with the end of the second metal line(20b). The second switching terminal(40b) is combined with the end of the third metal line(20c). The second switching terminal and the second probe pad(30b) are combined with both ends of the fourth metal line(20d). The first switching terminal and the second switching terminal are operated at the same time.
申请公布号 KR20090069501(A) 申请公布日期 2009.07.01
申请号 KR20070137188 申请日期 2007.12.26
申请人 DONGBU HITEK CO., LTD. 发明人 PARK, CHAN HO
分类号 H01L21/66 主分类号 H01L21/66
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