| 摘要 |
A sputtering apparatus is provided to reduce a manufacturing time and improve the efficiency of the apparatus by depositing a plural material on a signal chamber. A substrate plate(26) is fixed on the top of a vacuumable chamber, a first and a second target(25a, 25b) are faced with each other by a certain distance from a first and a second side. A first and the second target are settled on the first and second target plates(24a,24b). An adhesion prevention plate(40) is installed at the lower part of the chamber to reduce plasma damage and prevent diffusion of foreign material due to plasma damage to the bottom of the chamber.
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