ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME, AND WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

An electronic device, a manufacturing method thereof, a wiring substrate, and a manufacturing method thereof are provided to effectively emit a heat of an electronic part by thermally connecting a heat dissipation member to the electronic part through a heat dissipation path. A multilayer wiring structure(13) comprises insulation layers(14,24,36) and a wiring layer. An electronic part(12) is arranged on one surface of the multilayer wiring structure. A passive part(60) is arranged on the other surface of the multilayer wiring structure. A heat dissipation member is arranged on the other surface of the multilayer wiring structure. The heat dissipation path is formed on the multilayer wiring structure. One end part of the heat dissipation path is thermally connected to the heat dissipation member. The other end part of the heat dissipation path is thermally connected to the electronic part. A thermal bump(53) is formed on one surface of the multilayer wiring structure. The electronic part is thermally connected to the heat dissipation path through the thermal bump.