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发明名称
元件及元件制造方法
摘要
本发明之元件具备:第1基板,其主成分为二氧化矽;第2基板,其主成分为矽、化合物半导体、二氧化矽或氟化物中之任一种;以及接合功能中间层,其配置于第1基板与第2基板之间。第1基板系藉由常温接合而接合于第2基板,上述常温接合系经由接合功能中间层而使第1基板之经溅镀之第1表面与第2基板之经溅镀之第2表面接触。此时,接合功能中间层之材料与第1基板之主成分不同,且与第2基板之主成分不同,系选自氧化物、氟化物或氮化物中之具有透光性之材料。
申请公布号
TW200927636
申请公布日期
2009.07.01
申请号
TW097139604
申请日期
2008.10.15
申请人
三菱重工业股份有限公司
发明人
内海淳;后藤崇之;井手健介;高木秀树;船山正宏
分类号
B81B7/02(2006.01);B81C1/00(2006.01);C23C14/34(2006.01)
主分类号
B81B7/02(2006.01)
代理机构
代理人
陈长文
主权项
地址
日本
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