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发明名称
封装基板结构
摘要
本发明系有关于一种封装基板结构,其包括:一基板,其表面具有复数电性连接垫;复数金属凸块,系分别配置于该些电性连接垫表面;以及一介电层,系覆盖该基板及该些金属凸块,且该介电层具有复数凹口(recesses)以显露该些金属凸块顶部,其中该些凹口内表面系为粗糙化表面。再者,复可再包括复数焊料凸块设置于该介电层之凹口并覆盖该金属凸块顶部。由于为凹口内表面经过粗糙化处理,因此介电层与焊料凸块之结合力会因此增加。
申请公布号
TW200929467
申请公布日期
2009.07.01
申请号
TW096149219
申请日期
2007.12.21
申请人
全懋精密科技股份有限公司
发明人
胡文宏
分类号
H01L23/48(2006.01)
主分类号
H01L23/48(2006.01)
代理机构
代理人
吴冠赐;杨庆隆;林志鸿
主权项
地址
新竹市东区新竹科学工业园区力行路6号
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