| 摘要 |
A method for classifying same defect type of a wafer map is provided to improve an analysis time and accuracy by comparing a wafer map with a sample and determining whether it is a same defect or not. A method for classifying same defect type of a wafer map is comprised of the steps: a plurality of wafer map samples is stored by classifying a shape, a region, a property of a defect(1S); a wafer map is compared with a sample map(2S); if the result is included in the samples, a defect is determined as the same one(4S); if not, the defect is determined to be different with the sample(5S); and the defect which is determined different with the sample is stored as new one(6s).
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