发明名称 Method for making ohmic contact to silicon structures with low thermal loads
摘要 An ohmic contact for a silicon slider body is disclosed. A scanned laser beam locally heats a metal film on the slider body to interdiffuse the metal and silicon while minimizing the total thermal load on the slider body. This localized heating avoids thermal damage to the sensitive magnetic head region on the slider. The native oxide layer on the slider is removed by a sputter etch, followed by deposition of a diffusion layer. A capping layer is then deposited to reduce oxidation during subsequent processing. The metal layer is then locally annealed by scanning the laser beam over the target area. Contact resistance of less than 100 ohms is achieved while minimizing the thermal load on the slider body.
申请公布号 US7554055(B2) 申请公布日期 2009.06.30
申请号 US20050120820 申请日期 2005.05.03
申请人 HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V. 发明人 REILEY TIMOTHY CLARK;STRAND TIMOTHY CARL
分类号 B23K26/00;H01L21/44 主分类号 B23K26/00
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