| 摘要 |
A method and device for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the solder material arranged on the solder material carrier, wherein the at least one component is heated in a melt chamber (12) in a process atmosphere which is sealed off from the environment, whereby in a subsequent step the component is cooled in a cooling chamber (13) in a process atmosphere which is sealed off from the environment, and whereby the component is heated and cooled in process chambers (12, 13) which are independent of each other.
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