| 发明名称 |
Substrate and a method for polishing a substrate |
| 摘要 |
A substrate having flatness of less than 230 nmPV and surface roughness at RMS of less than 0.20 nm. is obtained by a method comprising: a process of polishing an object to be polished with a polishing pad comprising at least one layer having compressibility of 5% or below in a base layer of the polishing pad.
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| 申请公布号 |
US7553768(B2) |
申请公布日期 |
2009.06.30 |
| 申请号 |
US20060398703 |
申请日期 |
2006.04.06 |
| 申请人 |
OHARA INC. |
发明人 |
NAKAMURA KAZUYOSHI;NAKAJIMA TOSHIHIDE;NAKAJIMA KOUSUKE;OONAMI TAKAHISA |
| 分类号 |
H01L21/302;B24B37/24 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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| 主权项 |
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