| 摘要 |
In a light detecting device (3), a wiring board (12) is arranged on the surface side of a light detecting element (11) so that a first bonding pad region (15) formed on the surface of the light detecting element (11) is exposed. On the wiring board (12), a second bonding pad (17B) is formed in a region inside the first bonding pad (17A). Thus, in the light detecting device (3), a space for wire bonding can be positioned inside the light detecting element (11), and the sizes of the wiring board (12) and the light detecting element (11) can be substantially the same. As a result, in the light detecting device (3), an area to be occupied by the light detecting element (11) is sufficiently ensured in the light detecting device (3), and a dead region is reduced when the light detecting device (3) is arranged in matrix on a cold plate (2). |
