发明名称 |
Wireless communication module |
摘要 |
A wireless communication module includes: a module board including a module substrate having opposite first and second surfaces, conductive pads formed on the first surface, and an electronic component mounted to the second surface; a carrier stacked to the module board and having opposite first and second surfaces and a peripheral end that has a peripheral end face extending between the first and second surfaces of the carrier and formed with multiple spaced apart grooves; multiple spaced apart first conductive contacts formed on the first surface of the module substrate, and contacting a respective one of the module contacts; multiple spaced apart second conductive contacts formed on the second surface of the module substrate; and multiple conductive leads that interconnect the first and second conductive contacts. |
申请公布号 |
US7554189(B1) |
申请公布日期 |
2009.06.30 |
申请号 |
US20080041291 |
申请日期 |
2008.03.03 |
申请人 |
UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD. |
发明人 |
LI KUAN-HSING;CHEN CHIA-YANG |
分类号 |
H01L23/04;H01L23/12;H01L23/34;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|