Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same

摘要

A surface acoustic wave chip formed with an inter-digital transducer entirely over a piezoelectric substrate. In the surface acoustic wave chip, the inter-digital transducer is extended to a rim of the piezoelectric substrate, and a partition section is provided all the way to the rim of the piezoelectric substrate to partition an electrode pattern to derive two of the inter-digital transducers.