发明名称 Method of manufacturing a PCB having improved cooling
摘要 An improved cooling of an electronic component loaded to a printed circuit board, wherein the PCB comprises at its upper side at least one electronic component, and at least one heat conducting member inserted into a through-hole of the PCB, wherein the HCM extends from the upper side to the lower side of the PCB and has a thermal contact to the components.
申请公布号 US7552530(B2) 申请公布日期 2009.06.30
申请号 US20060603390 申请日期 2006.11.22
申请人 VERIGY (SINGAPORE) PTE. LTD. 发明人 MUELLER MARCUS
分类号 H05K3/30;H05K7/20;H01L23/367;H05K1/00;H05K1/02;H05K3/40;H05K3/42 主分类号 H05K3/30
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