| 摘要 |
A CMP(Chemical Mechanical Polishing) apparatus for manufacturing a semiconductor device and a CMP method using the same are provided to remove polishing byproducts and particles included in slurries by performing a polishing process using chemicals. A CMP apparatus for manufacturing a semiconductor device includes a polishing platen(110), a polishing head(120), a slurry supply nozzle(130), a deionized water supply nozzle(140), and a chemical supply nozzle(150). A polishing pad is attached on an upper surface of the polishing platen. The polishing plates is rotated by a driving unit. The polishing head is installed on the polishing pad. The wafer is closely attached on the polishing pad. The slurry supply nozzle is used for supplying slurries onto the polishing pad. A deionized water supply nozzle is installed on the polishing pad in order to supply the deionized water for cleaning the wafer after the polishing process. The chemical supply nozzle is used for supplying chemicals to clean the polished wafer.
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