| 摘要 |
An apparatus for heating an exhaust pipe in a semiconductor process is provided to improve heat transmission efficiency by separating a direct heating unit and a warming jacket part. A direct heating unit(110) is integrated with the exhaust pipe and heats the exhaust pipe directly. A wiring lead unit(120) is made of a rod shaped conductive member. The wiring lead unit connects the heating wiring inside the direct heating unit with the outside. A warming jacket part(130) has the same internal shape as the external shape of the exhaust pipe. The warming jacket part has the cylindrical shape with the hollow part inside. The warming jacket part is enveloped to be separated from the direct heating unit.
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