LIGHT EMITTING DIODE PACKAGE

摘要

A light emitting diode package is provided to reduce a manufacturing cost by reducing an amount of light transmissive transparent resin filled in a cavity. A pair of lead frames(112,113) are connected to at least one LED(Light Emitting Diode)(111) by a metal wire. A pair of lead frames are fixed to a package body(115). A cavity(117) is formed in the package body. An upper part of the cavity is opened. A light-transmissive transparent resin(116) covers the LED chip. The light-transmissive transparent resin is filled in the cavity. A recess(118) is formed in the bottom of the cavity. The depth of the recess is 50 to 400 um. The LED chip is mounted on the recess.