发明名称 A METHOD FOR PREPARING A POLYCARBONATE RESIN HAVING A LOW COEFFICIENT OF THERMAL EXPANSION
摘要 A polycarbonate resin of a semi-interpenetrating polymer network system is provided to secure excellent light transparence and low thermal expansion coefficient and to prepare a plastic substrate or a display optical film with excellent performance. A polycarbonate resin of a semi-interpenetrating polymer network system comprises the steps of: preparing a raw material mixture containing polycarbonate, a bisphenol-based compound having epoxy end groups and amine curing agent; and reacting the raw material mixture. The weight average molecular weight of polycarbonate is 400-50,000. The main chain of the polycarbonate comprises at least one repeating units represented by formula 1 or 2.
申请公布号 KR20090068651(A) 申请公布日期 2009.06.29
申请号 KR20070136351 申请日期 2007.12.24
申请人 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY 发明人 CHUN, HYUN AEE;MOON, IN KYU;PARK, IN;LEE, SANGK UG;CHOI, KYUNG HO;KIM, HYUN AH;NOH, JEE SUK
分类号 C08G64/40;C08G64/20;C08G64/42;C08L69/00 主分类号 C08G64/40
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