RESIN COMPOSITION FOR DIE ATTACHMENT ADHESIVE FILM CONTAINING PHENOLIC HARDENERS WITH MULTIPLE HYDROXYL GROUPS AND DIE ATTACHMENT ADHESIVE FILM BASED ON THE SAME

摘要

A resin composition for a die attachment adhesive film is provided to make up the step height of a printed circuit board due to flexibility and to manufacture a die attachment film with excellent crosslinked density and adhesive force. A resin composition for a die attachment adhesive film comprises base resin 100.0 parts by weight, initiator 0.1~10 parts by weight and phenol resin-based hardener 5~50 parts by weight. The base resin comprises ethylenic reactive resin 5~30 weight%, crosslinking resin 30~80 weight% and rubber resin 10~50 weight%. The phenol resin-based hardener comprises at least two repeating units per repeating unit of a polymer configuring phenol resin.