| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vapor augmented heat transfer device that is a cooling device. <P>SOLUTION: The heat transfer device includes a base chamber (110), a fin chamber, and at least one fin (130). The plurality of chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi-wick structure. The multi-wick structure can include a three-dimensional wick structure and/or a spatially varying wick structure. The multi-wick structure can include at least one crosslinking wick structure and provides a plurality of liquid flowing paths. Otherwise, the multi-wick structure can include a combination of a groove, a mesh, an agglomerate powder wick, or a foam wick. <P>COPYRIGHT: (C)2009,JPO&INPIT |
