发明名称 SUBSTRATE TREATMENT EQUIPMENT, METHOD FOR TREATMENT SUBSTRATE, AND STORAGE MEDIUM
摘要 PROBLEM TO BE SOLVED: To provide substrate treatment equipment which can control the consumption of a drying fluid and also prevent the contamination of the drying fluid. SOLUTION: The substrate treatment equipment is provided with: a substrate holding part 1 which holds a substrate W; and a treatment liquid supplying mechanism 2 which is provided with a first treatment liquid supplying part 2a which supplies a treatment liquid containing alkali to the substrate W held by the substrate holding part 1, and a second treatment liquid supplying part 2b which supplies the drying fluid to the substrate W held by the substrate holding part 1. A drying fluid discharge nozzle 2f of the second treatment liquid supplying part 2b is provided with: exterior piping which injects an inert gas; and a contamination inhibiting mechanism 8 which is provided in the exterior piping, and has a multi-structure with interior piping which discharges the drying fluid, and controls the second treatment liquid supplying part 2b to inject the inert gas from the exterior piping and shields the interior piping from open air when not discharging the drying fluid. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009141279(A) 申请公布日期 2009.06.25
申请号 JP20070318880 申请日期 2007.12.10
申请人 TOKYO ELECTRON LTD 发明人 NANBA HIROMITSU
分类号 H01L21/304 主分类号 H01L21/304
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