| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser dicing device and dicing method that select proper processing conditions stably regardless of the experience of an operator. <P>SOLUTION: Thickness of a wafer is measured using an SD camera, or the like (S12), and wafer property information indicating the information of the surface or the interior of a wafer is acquired (S14). Based on the thickness of a wafer thus measured, the thickness and the number of layers in a reforming region for dicing a wafer into chips are determined (S16). Based on the wafer property information acquired at S14, processing conditions for achieving the thickness and the number of layers in a reforming region determined at S16 are selected from a database (S18). <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
