| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor module, wherein an underfill charged in the gap between a semiconductor chip and a substrate hardly spreads to an undesirable region. SOLUTION: A copper foil pattern 2 (an electrode 20 group and a ground electrode 21) on a substrate 1 opposed to a flip-chip mounted semiconductor chip 5 is electrically connected to a copper foil pattern 2 (the electrode 22 group and a ground electrode 23) on the bottom surface side of the substrate 1 through a via conductor 3, and the liquid underfill 6 is injected and filled into the gap between the semiconductor chip 5 and substrate 1 in a state where a heat source 8 is brought into contact with the copper foil pattern 2 on the bottom surface side. Further, a solder resist film 4 is previously formed in a predetermined region on the substrate 1, and a frame portion 4a adjacent to a substrate surface exposed portion 10 at an outer periphery of the solder resist film 4 formed in a rectangular region A opposed to the semiconductor chip 5 is made to enclose the whole periphery of a mounting region for the semiconductor chip 5 without overlapping with the copper foil pattern 2. COPYRIGHT: (C)2009,JPO&INPIT
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