发明名称 Leadframe Receiver Package
摘要 The invention is a leadframe receiver package comprising a first conductive element, a solar cell electrically coupled to the first conductive element and comprising an active area, and a mold compound disposed on the leadframe and the solar cell. The mold compound defines a first aperture wall over at least a portion of the active area and a second aperture wall over at least a portion of the first conductive element. The mold compound includes a reflective surface to improve heat resistance around an aperture wall receiving solar radiation.
申请公布号 US2009159122(A1) 申请公布日期 2009.06.25
申请号 US20080250034 申请日期 2008.10.13
申请人 发明人 SHOOK GILL;CHAN HING WAH;LUDOWISE MICHAEL J.
分类号 H01L31/00;H01L21/00 主分类号 H01L31/00
代理机构 代理人
主权项
地址