发明名称 |
Platinbeschichtungsverfahren |
摘要 |
<p>A process for depositing pure platinum on a substrate is disclosed. In accordance with one embodiment, the process comprises applying a solution consisting of Pt(acetylacetonate)2 and ethanol or acetone onto a substrate and wrapping at least a portion of the substrate with aluminum foil. The process further comprises heating the substrate wrapped with the aluminum foil to about 300 DEG C at a rate of about 10-25 DEG C per minute and then holding at about 300 DEG C for about 1 hour, wherein the Pt(acetylacetonate)2 decomposes to deposit pure platinum on the substrate.</p> |
申请公布号 |
DE602004021074(D1) |
申请公布日期 |
2009.06.25 |
申请号 |
DE20046021074T |
申请日期 |
2004.09.29 |
申请人 |
GENERAL ELECTRIC CO. |
发明人 |
ACKERMAN, JOHN F.;ARSZMAN, PAUL V. |
分类号 |
C23C18/08;C23C4/12;C23C20/04;C23C26/00;F01D5/28 |
主分类号 |
C23C18/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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