发明名称 Platinbeschichtungsverfahren
摘要 <p>A process for depositing pure platinum on a substrate is disclosed. In accordance with one embodiment, the process comprises applying a solution consisting of Pt(acetylacetonate)2 and ethanol or acetone onto a substrate and wrapping at least a portion of the substrate with aluminum foil. The process further comprises heating the substrate wrapped with the aluminum foil to about 300 DEG C at a rate of about 10-25 DEG C per minute and then holding at about 300 DEG C for about 1 hour, wherein the Pt(acetylacetonate)2 decomposes to deposit pure platinum on the substrate.</p>
申请公布号 DE602004021074(D1) 申请公布日期 2009.06.25
申请号 DE20046021074T 申请日期 2004.09.29
申请人 GENERAL ELECTRIC CO. 发明人 ACKERMAN, JOHN F.;ARSZMAN, PAUL V.
分类号 C23C18/08;C23C4/12;C23C20/04;C23C26/00;F01D5/28 主分类号 C23C18/08
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