| 摘要 |
PROBLEM TO BE SOLVED: To provide an economical substrate heating and pressing method having advantageous throughput by enhancing the thermal conducting efficiency. SOLUTION: This heating and pressing method is for heating and pressing a first substrate (W1) and a second substrate (W2) and includes: a first suction process (S34) for vacuum-sucking the first substrate and the second substrate each at the retention face (TP); a pressing process (S35) for pressing the first substrate and the second substrate through the retention face; a first supplying process (S36) for stopping the vacuum-suction after the pressing process and for supplying a gas to the spaces between the retention face and the first and second substrates; and a heating process (S37) for heating the substrates. COPYRIGHT: (C)2009,JPO&INPIT |
